| 摘要 |
When the rear side of a heat resistant substrate having heating elements formed on the front side and a cooling board are adhered with an adhesive, the heat is accumulated in the substrate. To prevent this, the portions corresponding to the heating elements on the rear side are not adhered, but are protected with cooling compound, or adhesives are applied to both sides of the cooling compound, as it is known in prior parts, but they may cause uneven heat release from the substrate to the cooling board, or sacrifice the tacky action due to wetting of the adhesive with the cooling compound. In this invention, cooling compound or cooling adhesive is spread on the rear surface corresponding to the heating elements on the substrate, and an adhesive is applied to the parts separate from that area with grooves, thereby affixing the substrate and cooling member. As a result, the layer thickness of the cooling compound or cooling adhesive may be kept constant, and excessive heating compound flows into the grooves to avoid loss of the tacky action. Thus, excellent heat release is realized, and the printing quality is enhanced. Warps and waves of the heat resistant substrate are eliminated as being pressed and fixed to the cooling board.
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