| 摘要 |
<p>PURPOSE:To obtain a lead frame for a resin seal type semiconductor device which can connect an inner lead with an electrode pad without generating short-circuit of inner leads. CONSTITUTION:One or more second inner leads 5 fixed by an insulating tape 2 having adhesive layers on both sides and a conducting tape 6 is fixed to an inner lead 1. Thereby the inner lead 1 is electrically connected with an electrode 7 without intersecting with an Au wire 4 and making the inner lead 1 pass under the Au wire 4.</p> |
