| 摘要 |
<p>PURPOSE:To improve throughput by automatically adjusting shift in position of a substrate to be processed in a rotating processor. CONSTITUTION:A substrate W to be processed is mounted on a rotating holding means 20 by an arm 8 to be held there. A control part 24 has a substrate sensor means 22 positioned above a substrate periphery in this state, and a position of a cut 48 is detected by rotating once the substrate W. Then after the substrate W has been rotated to a position where a moving direction of the substrate sensor means 22 does not overlap the cut 48, the substrate sensor means 22 is brought close to the substrate W to sense its existing position. Then the substrate W is rotated by 180 deg. to sense the position of the substrate W similarly, so that eccentricity in the direction is obtained based on the result of 180 deg. rotation and the result the previously mentioned movement. Further after the substrate W has been rotated by 90 deg., the eccentricity in the direction is obtained similarly. The arm 9 is operated in X- and Y-directions based on the eccentricities to eliminate shift in position. Thus positioning of the substrate to be processed can be automated.</p> |
