| 摘要 |
<p>PURPOSE:To provide a means for manufacturing a multilayer board wherein resistance of a resistor can be modified after a green sheet is baked. CONSTITUTION:A conductor 3 is printed an each green sheet 1, printing for burying a via hole having been done, and on one of these green sheets (hereinafter referred to as the first green sheet), an opening 4 is formed, and a resistor 5 is printed on the other one (hereinafter referred to as the second green sheet), and then, with the first green sheet 1a as the top layer and the second green sheet 1b as the second layer, the green sheets 1, on which the conductor 3 is printed with the opening 4 assigned on the resistor 5, are laminated together and baked, thus a sheet of board is manufactured. Then, resistance modification (trimming) of the resistor 5 is done, and a terminal part 6 is provided an the first green sheet 1a, and a polyimide 9 is film-formed on the green sheet 1a and the resistor 5, and further on the top of it, Cr-Cu 10 is film-formed.</p> |
