发明名称 MULTILAYER INTERCONNECTION BOARD
摘要 <p>PURPOSE:To provide a multilayer interconnection board, in which a high-speed superconducting element like a Josephson device can function effectively for an electric signal transferred in a circuit wiring at high speed. CONSTITUTION:In a multilayer interconnection board, an insulating film 2 made of high polymer material and a circuit wiring film 3 are laminated alternately on a base insulating board 1. Each circuit wiring film 3 on upper and lower sides are electrically connected through a through hole 5 in the insulating film 2. The wall length of the through hole 5 in cross section should be 160mum or above.</p>
申请公布号 JPH06164152(A) 申请公布日期 1994.06.10
申请号 JP19920306740 申请日期 1992.11.17
申请人 KYOCERA CORP 发明人 TANAHASHI SHIGEO
分类号 H01L23/12;H05K1/11;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01L23/12
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