| 摘要 |
PURPOSE: To obtain a cadmium-free hard solder alloy which has a low working temperature, is easily deformable and can be generally worked by compounding specific ratios of silver, copper, gallium, indium and tin. CONSTITUTION: The cadmium-free hard solder alloy is constituted by using a silver alloy of a composition consisting, by weight %, of 45 to 80% silver, 5 to 25% copper, 10 to 25% gallium and 0.1 to 5% indium and tin. This solder alloy has the working temperature of about 600 to 530 deg.C and exhibits good wettability by even the use of a flux in air even under safe gas on copper, nickel, brass, iron-nickel alloy and steel. |
