| 摘要 |
<p>PURPOSE:To provide a leadframe and a manufacturing method thereof, in which a terminal is soldered with high reliability without causing a short-circuit between the terminal and adjacent terminals even when a pitch between outer leads is extremely narrow. CONSTITUTION:In a leadframe, a groove 2 is formed in the surface of an outer lead 6a which comes into contact with a terminal section 8 of a printed wiring board 9, and a solder section 3 is provided in the groove 2. In such a leadframe, the groove 2 is subjected to a surface treatment 1 having a superior solderability such as palladium plating.</p> |
