| 摘要 |
<p>PURPOSE:To easily upgrade the function or the capacity of a semiconductor device by making a metal base peripheral part which constitutes the bottom wall surface of a cylinder-shaped resin-made case body engage with the sidewall part of the resin-made case body and mounting based on an insert molding die so that they may be integrated into one piece. CONSTITUTION:There is laid out a cylinder-shaped resin-made case body 8 where a row of outside connection terminals 9 are installed so as to penetrate the sidewall where a metal base 10 is installed, which seals one end opening of the case body 8 and constitutes the bottom wall surface. A thick film circuit board 11 is installed, which is mounted and laid out on the surface of the metal base 10 in the case body 8. An electrode component 12 is electrically connected to the thick film circuit 11 and the electronic component 12 is connected to the outside connection terminal 9 by way of a connection lead 13 connected to an input terminal 11a. The peripheral part of the metal base 10 is insert- molded and sealed and mounted in such a fashion that it may be engaged and integrated with the sidewall part of the case body 8. This construction makes it possible to attain highly reliable packaging and connection performance as well.</p> |
