| 摘要 |
<p>PURPOSE:To form a thin and small chip without damage of even a large-sized semiconductor wafer and to eliminate a rear surface chipping by dicing the wafer before a rear surface of the wafer is polished, and then polishing the rear surface of the divided wafer. CONSTITUTION:When a semiconductor wafer 2 is divided into chips 4, the step of dicing the wafer 2 is conducted before a rear surface of the wafer 2 is polished. After the dicing step, the step of polishing a rear surface of the divided wafer 2 is executed. For example, the wafer 2 is previously divided into chips 4 by the dicing step, the diced chips 4 are adhered to an adherent tape 5 of a frame 3 by turning the rear surfaces 4a to upside after dicing. The frame 3 is fixed to a cap table of a polishing machine 7, and the step of polishing the rear surface 4a of the chip 4 with a polishing grindstone 6 is conducted.</p> |
