| 摘要 |
<p>PURPOSE:To automatically detect a position of a cutting line and to input detected positional information directly to a controller for a dicing unit by imagine one of shot patterns, fetching its image information, processing the information to detect a position of a cutting line. CONSTITUTION:A position of a cutting line is detected when a semiconductor wafer 11 in which a pattern of an assembly of a plurality of devices are repeatedly present is diced. In this case, the wafer 11 is imaged, its image information is fetched, and fetched image information is processed to detect the position of the line. Then, one of the patterns is imaged based of the detected positional information, and the information is fetched. Thereafter, the fetched information is processed thereby to detect the position of the line of the pattern. For example, a position of a shot pattern is detected from information of a flat surface of a periphery of the wafer 11.</p> |
