SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To shorten the processing time, improve massproductivity and ensure high reliability against the requirement for introduction of multiple pins of a semiconductor device in view of facilitating treatment at the time of mounting. CONSTITUTION:The end portion of an inner lead 4a is extended up to a terminal part of a semiconductor chip 2 to connect in direct to such terminal via a gold bump 7. At the inside of a mold 5, a bending portion 4c is formed in the course of the way to the terminals of the inner lead 4a. The bending portion 4c is formed in such a manner that the external part of the longitudinal direction of the inner lead is deformed in the side of the inner lead where the semiconductor chip is connected and height of the bending portion is set a little larger than the thickness of the semiconductor chip. With a spring function of this bending portion 4c, a bending force or a tensile force to be applied on the inner lead 4a during the molding by resin can be absorbed to prevent breakdown failure of the connecting portion.