发明名称 |
PRODUCTION OF INTEGRATED PRINTED CIRCUIT BOARD MOLDED FORM |
摘要 |
PURPOSE:To produce a molded form which is little in warpage and accurate by setting the temperature of a male mold higher than the temperature of a female mold. CONSTITUTION:A prescribed circuit pattern 2 is formed on the face of one side of a printer circuit board 1 anal an adhesive layer 3 is formed on the face of the other side. The face of the circuit pattern of the printed circuit board 1 is fixed on the face of the male mold 5 of an injection molding machine and combined with a female mold 6 having an injection gate 7. An integrated printed circuit substrate molded form is produced by injecting molten resin from an injection gate 7 and integrating the printed circuit board 1 with a resin form 8 having a prescribed shape through the adhesive layer 3. In the case of producing the same, the temperature of the male mold 5 is set higher than the temperature of the female mold 6 and preferably set while keeping the temperature difference of 10-30 deg.C. |
申请公布号 |
JPH06238709(A) |
申请公布日期 |
1994.08.30 |
申请号 |
JP19930054679 |
申请日期 |
1993.02.22 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YOSOMIYA TAKATOSHI;MAZAKI TADAHIRO |
分类号 |
B29C45/14;B29C45/73;B29L31/34;H05K3/00;H05K9/00;(IPC1-7):B29C45/14 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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