| 摘要 |
An imaging device 1 is provided with: an imaging element 10 that comprises a light-receiving surface 10SA, a facing surface 10SB, and an inclined surface 10SS inclined at a first angle θ1, said light-receiving surface 10SA having a plurality of light-receiving surface electrodes 12 formed thereon; a cover glass 30; and a wiring board 40 comprising a plurality of pieces of wiring 41W that are individually connected to each of the plurality of light-receiving surface electrodes 12. The cover glass 30 and the plurality of light-receiving surface electrodes 12 extend to the exterior of the edge side of the inclined surface 10SS. The rear surfaces of the light-receiving surface electrodes 12 are exposed on the facing surface side. The tips of the wiring 41W are flying leads that are electrically connected with the light-receiving surface electrodes 12 and that are bent at a second angle θ2 supplementary to the first angle θ1. The tip of the wiring board 40 is fixed to the facing surface 10SB of the imaging element 10. |
