| 摘要 |
<p>PURPOSE:To enhance a heat-dissipating property and to reduce a thermal resistance in a power semiconductor device. CONSTITUTION:In a power semiconductor device, a light-emitting element 13 which converts an electric signal into light, a photodetector 14 which converts the light from the light-emitting element 13 into an electric signal and a triac element 15 which is connected to the photodetector 14 are provided, and they are sealed with a resin. In the power semiconductor device, the light-emitting element 13 and the photodetector 14 are sealed with a light-transmitting resin 16, and the light-transmitting resin 16 and the triac element 15 are sealed with a light-shielding resin 17 whose thermal conductivity is high.</p> |
