发明名称 FLOOR SUPPORT MATERIAL FOR FLOOR WIRING AND PIPING STRUCTURE
摘要 <p>PURPOSE:To provide a floor support material for a wiring and piping floor structure which can reduce the works required for removing floor panels of the entire area and effectively install the wiring and piping materials under the floor without removing machines on the floor. CONSTITUTION:This floor support material is composed of a passage member 310 and a leg member 320. The long passage member 310 has a body 311 having a passage 315 opening upward and a cover 312 covering the opening of the passage 315 of the body 311 so that when the opening of the passage 315 is covered with the cover 312, a hollow guide path 154 having the slit at the side area is formed. A projected piece 314 forms the cover of the guide path 154, the upper part of the guide path 154 opens when the cover 312 is removed in view of forming an inserting port through which the installation tools can be carried.</p>
申请公布号 JPH06292318(A) 申请公布日期 1994.10.18
申请号 JP19930322342 申请日期 1993.12.21
申请人 MIRAI IND CO LTD 发明人 SHIMIZU SHOHACHI
分类号 E04F15/18;E04F15/024;H02G1/06;H02G3/04;H02G3/38;(IPC1-7):H02G3/28 主分类号 E04F15/18
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