| 摘要 |
PURPOSE: To manufacture a contact pin with high efficiency by forming a first metal layer made of a material which can be bonded to a material of the pin on a flat substrate layer, and plating a second metal layer serving as the contact pin so as to secure sufficient overdrive and a substantially uniform, sufficient contact pressure with respect to an increased demand in the number of pins and a decrease in width of the pin. CONSTITUTION: In a resist pattern forming process, a copper layer 1 is coated with a photoresist 12, followed by exposure via a mask 13. Thereafter, Ni is deposited and grown by electric plating in a cavity 12a at the upper portion of the copper layer 11, exposed in a portion which is not masked with the resist. Subsequently, the Ni layer 14 is covered with a polyimide film 15 for covering a pattern 14e or the like except for a tip 14d. A portion composed of the copper layer 11, the Ni layer 14 and the film 15 is peeled off from the plate 10. The copper layer 11 is removed from the Ni layer 14 by wet etching. |
