| 摘要 |
PURPOSE:To provide a multilayer printed wiring board having a pad & a surface via hole where component mounting pads are installed on a surface via hole which connects an outermost circuit to its neighboring inner layer circuit and its efficient manufacturing method. CONSTITUTION:A copper foil which is preliminarily bored at a specified position and a prepreg 5 are combined on a stainless steel plate (SUS 1) where a copper plating layer 2 is formed, thereby performing hot and pressure forming. Then, the copper foil is removed and laser light is emitted to the copper foil-removed area, thereby removing the resin in that area and providing a non-penetration hole. After the formation of a copper plating layer and an inner layer circuit 10 and a surface via hole 8, the SUS 1 plate is separated from its interface with the copper plating layer 2. Inner layer printed boards 11 and 12 thus formed and a prepreg 25 are combined so that hot and pressure forming may be performed again. After having bored a hole, copper plating is carried out, thereby froming a copper plating layer and a penetration T/H. Finally, there are formed a pad & a surface via hole to which a component mounting pad is installed on the outer layer circuit and the surface via hole 8. |
