| 摘要 |
PURPOSE:To provide the mounting structure, which requires no facility introduction on a large scale and can be mounted and dismantled simply in a short time and in which shock resistance and the effect of heat dissipation are improved, unnecessary radiation is reduced and the deterioration, etc., of performance due to moisture, etc., can be prevented, of a circuit component. CONSTITUTION:An LSI module, in which connecting terminals are aligned previously, is fixed temporarily to a wiring board 5 by an adhesive member 4 such as a double-side tape, and a pushing member 8 having elasticity is installed, and covered with a covering member 9. An engaging piece 10 for mounting is inserted into through-holes 7 for mounting, the covering member 9 is pushed in the direction of the wiring board 5, and the engaging piece 10 is caulked and fixed, thus pushing a flexible substrate 2 by the projecting sections 13 of the pushing member 8, then mutually connecting connecting terminals. |
