| 摘要 |
<p>PURPOSE: To cope with the tilt of the surface of a chip to a plane which is vertical to the axis of the chip, misalignment and fluctuation in chip heights by realizing customized engagement of the cold plate of a heat transmission module with the chip to be cooled. CONSTITUTION: A cold plate 12 is provided with a channel 16, and the channel 16 extends through a path, which closely adjoins the wall of the inner hollow 14 of the cold plate 12. As a cooling medium passes through the channel 16, it absorbs heat from the cold plate 12. A heat sink is formed by cooling the cold plate 12, and heat from the electronic chip is transmitted by heat transmission. Since the cold plate 12, which is customized for an electronic chip 22 on a chip supporting board 20 and the direction of the chip, is formed, a piston 18 is positioned on the surface of the chip 22 closely and by orientation, and is soldered to the wall of the hollow 14.</p> |
