| 摘要 |
<p>PURPOSE:To provide a semiconductor device which can prevent the increase of its chip area even when the area of its internal circuit increases. CONSTITUTION:A semiconductor storage device A is divided into a memory chip section 1 and test chip section 7 by a dicing line DL3 drawn between pads 3 for evaluation and an internal circuit 4. When the storage device A is subjected to evaluation tests, the chip sections 1 and 7 are cut off in one unit and assembling is performed on the sections 1 and 7 for the tests. When the device A is not subjected to the tests, the chip sections 1 and 7 are separately cut off from the dicing line DL3 and assembling is performed only on the section 1.</p> |
