发明名称 THERMOSETTING RESIN INJECTION DEVICE
摘要 PURPOSE:To provide a thermosetting resin injection device that can inject a plasticized material into a mold after a gas produced at the time of plasticizing the thermosetting resin material is sufficiently released. CONSTITUTION:A material supply means consists of a feed cylinder 32 for plasticizing a thermosetting resin material 50; a material introducing hopper 36 mounted on the feed cylinder for introducing the material; a feed screw 38 inserted in the feed cylinder for feeding the plasticized material forward; a die 42 for extruding the plasticized material, that has been fed forward by the feed screw, in a rope form; and a cutter device 116 mounted in the vicinity of the die for cutting the plasticized material into pellets 52. The top of the material supply means is disposed upward of a pellet supply opening part 17 provided in a heating cylinder 16 of an injection device. The aforesaid cut plasticized pellet material falls through the pellet supply opening part to be supplied into the heating cylinder.
申请公布号 JPH079491(A) 申请公布日期 1995.01.13
申请号 JP19930176064 申请日期 1993.06.22
申请人 MEIKI CO LTD 发明人 KOYAMA HIRONORI
分类号 B29C31/00;B29C45/00;B29C45/18;B29K101/10;(IPC1-7):B29C45/18 主分类号 B29C31/00
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