| 摘要 |
<p>PURPOSE:To rapidly remove the charges accumulated on a wafer and easily release the wafer without making scratches on the wafer by covering at least the surface of a releasing knock pin for releasing the wafer from an electrostatic chuck with conductive ceramics. CONSTITUTION:At least the surface of the releasing knock pin 28a which releases a wafer S from an electrostatic chuck 24 which is integrated into a semiconductor manufacturing equipment 10 is covered with conductive ceramics. For example, a plurality of releasing knock pins 28a formed of conductive ceramics which contains TiO2 by 70% with SiO2 as binder are provided. In case of releasing the wafer S from the electrostatic chuck 24 after dry-etching the wafer S, a DC power source 25 is turned off, the releasing knock pins 28a are permitted to abut on the wafer S and the charges accumulated on the wafer S are removed.</p> |
