| 摘要 |
<p>PURPOSE: To provide a method and apparatus for cutting semiconductor wafers, suitable for manufacturing laser diodes en bloc on a large scale. CONSTITUTION: A wafer 11, having scribe lines 15 defining sections to be cut, is set between a pair of flexible feed bands 12, 13 and guided to the periphery of a large-radius curved surface 21 to render a bending moment, thereby cutting a semiconductor wafer or its piece. A moment which is sufficiently large is applied to the wafer running to cut it into rods 22, each having cut faces at the front and rear ends. The cut rods continuously pressed to the curved surface 21 result in automatically separated rods, thus blocking the cut faces of the adjacent rods from mutually damaging. For carrying the rods to post-treating step, e.g., an evaporating zone for depositing an inactivated layer, facilities for leaving the rods separated are prepared.</p> |
