| 摘要 |
PURPOSE:To provide an electronic circuit device of resin forming type which does not require a case for protection resin. CONSTITUTION:A protection resin 6 which covers an electronic circuit board 2 and electronic components 3 and connect the electronic circuit substrate 2 and a connector 4 in one piece is constituted of a resin material which is poured, by the low-pressure molding method, into a mold in that the electronic circuit substrate 2 where the electronic components 3 are fitted and a connector 4 are positioned. Since the resin material is poured into the mold by the low- pressure molding method, it fully spreads into the mold. At the same time, the electronic components 3 are not damaged since the resin material is poured into the mold at a low pressure by the low-pressure molding method. Also, no case for the protection resin 6 is required. |
