| 摘要 |
PURPOSE:To obtain an equipment capable of easily and immediately corresponding to a small-lot production and a mass production in resin seal molding an electronic component part and molding a high-quality and-reliability product without forming a void or a defective part in/on a resin-sealed molded body. CONSTITUTION:To a molding device 5 of a resin seal molding equipment composed of minimum components in conbination for resin seal molding an electronic component part, another molding device 5 is appropriately added. In this manner, a resin seal molding equipment corresponding to a mass production is easily formed without increasing the size of a mold 28 per se. On the other hand, a resin seal molding equipment corresponding to a small-lot production is easily formed without reducing the size of the mold 28 per se by appropriately removing the added molding device 5. |
