发明名称 MOLDING DEVICE FOR MOLDED PART ON HOOP LEAD FRAME
摘要 PURPOSE:To obtain a small-size molding device and reduce a molding cost of a molded part in a molding device for molding a molded part by providing a lower mold and an upper mold on the lower and upper surfaces of a hoop lead frame fed in an approximately horizontal state and providing a lead frame feed means at a lead frame inlet of both the molds. CONSTITUTION:In a construction wherein a mold only one side is reciprocated to a mold on the other side, one mold 1 is foamed as a movable mold and the other mold 2 is formed as a stationary mold. Guide members 10, 11 provided with circular guide faces 10a, 11a are respectively provided on the side of both the molds at a feed means 8 and on a lead frame inlet part of the movable mold 1.
申请公布号 JPH0732412(A) 申请公布日期 1995.02.03
申请号 JP19930180126 申请日期 1993.07.21
申请人 ROHM CO LTD 发明人 OOHATA HISAKAZU
分类号 B29C45/14;B29C45/26;B29L31/34;H01L21/56;(IPC1-7):B29C45/14 主分类号 B29C45/14
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