| 摘要 |
<p>PURPOSE:To make it possible to mount on a small-sized circuit board even in the case of a high-density multipin package, concerning a semiconductor device to be placed in a state of standing vertically on the mounting surface of the circuit board. CONSTITUTION:A metal stage 15 for placing a semiconductor device 13 on, a plurality of printed wiring boards 17 and 18 having windows 22 for enclosing the semiconductor device 13 and laminated on a surface of the metal stage 15 on which the semiconductor device 13 is placed, are provided, and a plurality of vertically-standing means 12a, 12b, 12c, and 12d are formed on both sides of the board counter side 19 of the metal stage 15. Besides, connecting means 14 are formed by printed wiring so as to extend between the respective board counter sides 20 and 21 of a plurality of printed wiring boards 17 and 18 and the peripheries of the respective windows 22 of the printed wiring boards 17 and 18, and are formed in a freely surface-mountable state on the mounting surface of a circuit board 11 in the vicinities of the respective board counter sides 20 and 21 of the printed wiring boards 17 and 18.</p> |
