| 摘要 |
PURPOSE:To provide the method which allows direct and selective heating of microcapsules in an adhesive layer to thereby cause the expansion and/or collapse of them and which hardly applies a load, such as heat, to an adherend covered with the adhesive layer and hence hardly affects the adherend. CONSTITUTION:Microcapsules having electrically insulating shells and contained in an adhesive layer are subjected to high-frequency dielectric heating and thereby expanded and/or collapsed. Thus, the method is widely applicable to a low-heat-resistant article, a large article, etc., is excellent in the response to heat buildup and in uniformity of heat buildup in the whole adhesive layer, and enables the objective treatment to be done in a short time without damaging an adherend. |
