| 摘要 |
<p>PURPOSE:To provide a method of contact with which all bump contact points on a flexible circuit substrate can be brought into contact with the part to be contacted of the microscopic objective of contact formed in high density, and also to provide a connection structure of high contact reliability. CONSTITUTION:A flexible circuit substrate (a), having a bump contact point on one surface and an elastic material 7 on the position corresponding to the back side, and a contact objective (b), having a plurality of parts to be contacted 5 such as an LSI chip and the like, are formed into a laminated body by laminating in such a manner that a plurality of bump contact points and a plurality of parts to be contacted are opposed on junction surface. Pressing means 6a and 6b are provided in such a manner that the laminated body is pinched in the direction of lamination, pressing force F is added in the direction of compression on the whole surface of the laminated body, and the plurality of bump contact points and the plurality of parts to be contacted are brought into contact with each other simultaneously.</p> |
