| 摘要 |
PURPOSE:To provide a multilayer circuit board in which a polishing step is not required after the board is formed. CONSTITUTION:A multilayer circuit board having a conductor path made of a conductive material in a board made of a baked material and formed with a conductive layer on a surface of the board in such a manner that the layer is formed in a thin film by a thin film method using glass-ceramic composite material as sintered material and group 4A, 5A and 6A metals and/or their compounds. |
