ADHESIVE FOR BONDING ELECTRONIC PART

摘要

PURPOSE:To obtain an adhesive for bonding electronic parts which facilitates repair of bonding defects and control of the amt. of the adhesive applied, is of one-pack type, and has a long pot life and a greatly improved workability. CONSTITUTION:The adhesive of one-pack type is prepd. by mixing the main component contg. a repairability improver and a thixotrpic agent with a capsulated curative obtd. by coating a monomer reactive with the main component with a resin.