发明名称 MOLDED FORM WITH SMOOTH SURFACE AND MANUFACTURE THEREOF
摘要 PURPOSE:To continuously manufacture a high-grade design molded form having excellent, surface smoothness by a molded form in which thermosetting resin of a skin layer is bonded to thermosetting resin of a molded form body with many pores each having a specific diameter of an intermediate film and which has a smooth surface in such a manner that an entire pore area of the film occupies a specific percentage of the film. CONSTITUTION:An intermediate film 4 made of thermoplastic resin is entirely perforated uniformly with many pores 21 each having a diameter of 0.1-1.5mm in such a manner that an area of the entire pores is 20-70% of the entire film. In this case, when the diameter of the pore 21 of the film 4 exceeds 1.5mm or the entire area of the pores 21 exceeds 70%, a pattern printed on a surface of the film becomes unfavorable. When the diameter of the pore 21 is smaller than 0.1mm or the entire area is smaller than 20%, a contact area of the resin for molding a molded form body with the resin for molding a skin layer is reduced to lower its adhesive strength. As reinforcing fiber to be used, glass fiber, etc., is included, but it is preferable to set its volumetric content of 30-50%.
申请公布号 JPH07108621(A) 申请公布日期 1995.04.25
申请号 JP19930258225 申请日期 1993.10.15
申请人 SEKISUI CHEM CO LTD 发明人 UEDA AKIHIRO;OKUBO MITSUO
分类号 B32B5/24;B29C69/00;B29C70/52;B29K101/10;B29K105/04;B29K105/08;B29L9/00;B32B17/04;B32B27/06;(IPC1-7):B29C70/52 主分类号 B32B5/24
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