| 摘要 |
PURPOSE:To manufacture raw material chips not fusing to machine walls by setting a multiple fusing peak temperature measured by DSC in a specific range, and allowing the heat absorption amount to be a specific value or more in isophthalic acid copolymcrlc polyester chips. CONSTITUTION:Isophthalic acid copolymeric polyestar chips are determined to be in the range of 100-160 deg.C in its Tm' measured by DSC and 0.1cal/g or more in its heat absorption amount. Herein, Tm' is a multiple fusing peak temperature generated at the side of lower temperature than Tm. In its crystallization, the dry machine wall temperature during chip supply in an atmosphere of gas is a glass-transition temperature of the chips prior to crystallization or lower and raised to the temperature in 10-40min in temperature a formula described below. Herein. the formula is made 3.4M+66.5<T<3.4M+96.5, and M denotes an isophthalic acid copolymeric rate (mol%). In this manner, raw material chips for metal plating film can be obtained which have no fusion to machine walls, and also have no risk of causing coloring and deterioration. |
