| 发明名称 |
Structure for coupling between low temperature circuitry and room temperature circuitry. |
| 摘要 |
The present invention provides a structure for coupling between a low temperature circuitry cooled by a cooling means and a room temperature circuitry comprising a means for electric connection and a second cooling means specifically for cooling of said means for electric connection. |
| 申请公布号 |
EP0650192(A2) |
申请公布日期 |
1995.04.26 |
| 申请号 |
EP19940402380 |
申请日期 |
1994.10.21 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LIMITED |
发明人 |
TOKUDA, HITOKI, C/O OSAKA WORKS OF;IIYAMA, MICHITOMO, C/O OSAKA WORKS OF |
| 分类号 |
H01L39/00;H01L23/34;H01L23/44;H01L39/02 |
主分类号 |
H01L39/00 |
| 代理机构 |
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