| 摘要 |
<p>PURPOSE:To enhance the adhesion of an electrode layer to the side face of a ceramic board by subjecting the side face to surface treatment with an acid based solution when the electrode layer is formed on the side face of the ceramic board. CONSTITUTION:A rod-like piece 11 is subjected, on the opposite side faces 11'a, 11'b in the longitudinal direction to surface treatment by immersing the piece 11 into a hydrofluoric acid solution or spraying its vapor to the opposite side faces. The opposite side faces 11'a, 11'b are then cleaned and dried before a side face electrode layer 17 is formed while partially overlapping the surface and rear surface electrode layers 13, 15. The side face electrode layer 17 is formed by sputtering or depositing a metal, e.g. Ni-Cr or Ti, or coating and curing a conductive resin paste, e.g. an Ag resin. This structure enhances the adhesion of the electrode layer to the cut face of the ceramic board thus realizing a highly reliable chip electronic device.</p> |
