| 摘要 |
<p>Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station (S) and the scribed wafer transported in the X direction to a breaking station (B) on an X-Y table (3, 9). Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table (3). Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table (18) carried on the Y table (3). An impulse bar (28) is carried by the X table (9) for applying force to the bottom surface of the wafer during both scribing and breaking. Scribing and breaking parameters needed to scribe and break the wafer are entered into computer memory and operated upon by computer controls to automate the scribing and/or breaking process.</p> |
