发明名称 METHOD AND DEVICE FOR SURFACE POLISHING WIRE MATERIAL
摘要 PURPOSE:To provide favorable surface polishing without changing polishing material by filling a closed space of a wedge-like form with grain material for polishing, and running a wire material through it, so the grain material for polishing flows as the wire material runs to get in contact with the surface of the wire material. CONSTITUTION:A wire material 1 is supplied through a cylindrical body 4, grain material 5 for polishing is injected from an injection port 9 after that to fill the inside of the cylindrical body with the grain material 5 for polishing. In polishing, the injection port 9 is closed with a cap 10 for preventing leak of the grain material 5 outside. As polishing is started by running the wire material 1 by a wire material takeup means, the grain material 5 inside the cylindrical body 4 flows in a wedge-shaped space in the cylindrical body 4 to generate loop currents as illustrated with arrows. The grain material thus flows along the wire material l to fold back at the position of a nipple 8 to get apart from the wire material 1, where loop currents in inverse directions are generated. The grain material 5 to get in contact with the wire material 1 is always renewed to have high polishing ability, thereby favorable polishing can be assured for a long time.
申请公布号 JPH07186015(A) 申请公布日期 1995.07.25
申请号 JP19930336986 申请日期 1993.12.28
申请人 HITACHI CABLE LTD 发明人 SUGIYAMA SATOSHI
分类号 B24B5/38;B24B29/00;(IPC1-7):B24B5/38 主分类号 B24B5/38
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