发明名称 PRODUCTION OF MULTILAYER CERAMIC CIRCUIT BOARD
摘要 <p>PURPOSE:To enhance the quality while increasing the yield by laminating a thin green sheet such that the outer peripheral end thereof is located on the inside of the outer peripheral end of a thick green sheet thereby preventing the thin green sheet from being chipped. CONSTITUTION:Tungsten is printed on the surface of a thick green sheet 1 to form a conductor layer 4 and then the thick green sheet 1 is cut into thin green sheets 2. Four thin green sheets 2 are laminated on the thick green sheet 1 with a blank part 3 being provided between the outer peripheral end parts 1a, 2a of both green sheets 1, 2. A tungsten conductor is printed on the surface of the thin green sheet 2 every time when it is laminated thus forming a conductor layer 5. A thick green sheet 6 is then laminated on the laminated thin green sheets 2 thus forming a package. This method prevents projection of the thin green sheet 2 from the thick green sheets 1, 6.</p>
申请公布号 JPH07202438(A) 申请公布日期 1995.08.04
申请号 JP19930353364 申请日期 1993.12.29
申请人 SUMITOMO KINZOKU CERAMICS:KK 发明人 SHIGETOMI YOSHIHIRO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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