INSULATING ADHESIVE TAPE, AND LEAD FRAME AND SEMICONDUCTOR DEVICE EMPLOYING THE TAPE.

摘要

An insulating adhesive tape comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide. The thermoplastic polymer has a glass transition temperature ranging from 180 DEG C to 280 DEG C and an elastic modulus ranging from 10<1><0> dyne/cm<2> to 10<1><1> dyne/cm<2> at 25 DEG C, said modulus including a value ranging from 10<2> dyne/cm<2> to 10<9> dyne/cm<2> at a temperature between 250 DEG C and 300 DEG C.