| 摘要 |
The bonding apparatus is useful to form electric connections between predetermined bonding pads (A) of semiconductor electronic devices (D) and respective electric contact leads (L) formed on a frame (T) holding the devices (D) in tidy arrangement. It comprises a supporting structure (2), means of advancing the frame (T) along a longitudinal direction (X) in a work plane (3) on the supporting structure (2), a bonding head (4), and a high-precision X-Y table (5) carrying the bonding head (4) for accurately setting the bonding head (4) in the work plane (3). The bonding apparatus further comprises a carriage (10) guided on the supporting structure (2) for movement in a transverse direction (Y) to the longitudinal direction (X), the X-Y table (5) being mounted on said carriage (10). The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows. <IMAGE> |
