| 发明名称 |
Metallization composite having nickle intermediate/interface |
| 摘要 |
A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.
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| 申请公布号 |
US5457345(A) |
申请公布日期 |
1995.10.10 |
| 申请号 |
US19940182310 |
申请日期 |
1994.01.14 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COOK, HERBERT C.;FARRAR, SR., PAUL A.;GEFFKEN, ROBERT M.;MOTSIFF, WILLIAM T.;WIRSING, ADOLF E. |
| 分类号 |
H01L21/28;H01L21/60;H01L23/485;H01L29/45;(IPC1-7):H01L23/48;H01L29/46;H01L29/54;H01L29/62 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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