| 摘要 |
<p>PURPOSE:To reduce the thickness of the card itself and to prevent inductance from being lowered by removing a base material for prescribed width by successively helically winding a wire while inserting the wire to a slit and arranging it on the other face of the next cutting piece. CONSTITUTION:With one intersection such as the first intersection of a first slit 22-1 on a reference circle as a starting point, for example, a wire 8 is arranged on one face (the surface) of a first cutting piece 24-1 and when that wire reaches a second slit, 22-2 as a first slit, the wire 8 is inserted to this second slit 22-2 and arranged on the other face (rear face) of a second cutting piece 24-2 as the next cutting piece. Thus, the wire 8 is successively arranged on the faces of respective slits 22 and respective cutting pieces 24 and when the wire 8 returns to the first slit 22-1, this wire 8 is arranged on the other face (rear face) of the first cutting piece 24-1 and arranged on any face different from the first time at the time of next winding. Then, the wire 8 is helically wound for width A in the shape of a loop.</p> |
