CHIP ON FILM UNIT

摘要

In the technical field of liquid crystal technology, a chip on film unit is provided. The chip on film unit comprises a soft dielectric layer, a plurality of pins for input signals disposed on the dielectric layer, and a first drive circuit module and a second drive circuit module. The first drive circuit module is connected with at least a portion of the pins for the input signals, and cascade wires are disposed between the first drive circuit module and the second drive circuit module for transmitting cascade signals therebetween. The number of signal channels in each of the drive circuit modules can be half of that required by the entire chip on film. As a result, the signal channels are distributed in a plurality of drive circuit modules, and the thermal efficiency can be significantly improved.

主权项

1. A chip on film unit, comprising:
a soft dielectric layer, a plurality of pins for input signals disposed on the soft dielectric layer, and a first drive circuit module and a second drive circuit module, wherein the first drive circuit module is connected with at least a portion of the pins for the input signals, and cascade wires are disposed between the first drive circuit module and the second drive circuit module for transmitting cascade signals therebetween.