| 发明名称 |
SYSTEM AND METHOD FOR CHEMICAL MECHANICAL PLANARIZATION PROCESS PREDICTION AND OPTIMIZATION |
| 摘要 |
A system for processing a semiconductor wafer includes a database configured to store data including relationships between device pattern characteristics, chemical mechanical polishing (CMP) conditions, and CMP performance, a data analyzer configured to predict performance of a CMP process to be performed on a wafer based on wafer design data and the relationships included in the database, and an output device configured to output the predicted performance of the CMP process. |
| 申请公布号 |
US2016365253(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201514950899 |
申请日期 |
2015.11.24 |
| 申请人 |
Macronix International Co., Ltd. |
发明人 |
CHEN Kuang-Wei;CHEN Chun-Fu;LUOH Tuung |
| 分类号 |
H01L21/3105;H01L29/06;H01L21/762;G06F17/50;H01L21/66 |
主分类号 |
H01L21/3105 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for processing a semiconductor wafer, comprising:
a database configured to store data including relationships between device pattern characteristics, chemical mechanical polishing (CMP) conditions, and CMP performance; a data analyzer configured to predict performance of a CMP process to be performed on a wafer based on wafer design data and the relationships included in the database; and an output device configured to output the predicted performance of the CMP process. |
| 地址 |
Hsinchu TW |
