| 摘要 |
A packing device for semiconductor devices with lead terminals includes a packing box, partitions for separating a space in the packing box, and a cover. A conductive sponge used as a cushioned packing material is attached to the back surface of the cover. The semiconductor devices are placed in the packing box 3 with the lead terminals 2 facing upwardly. In this packed state, the conductive sponge is pressed against the lead terminals to collectively hold the semiconductor devices securely in the box. Thus, short-circuitting of the lead terminals is made to prevent gate of the semiconductor devices from breaking down as a result of electrostatic voltage.
|
