| 摘要 |
<p>PURPOSE:To prevent peeling and rupturing of flattening films by improving a flattening treatment in a multilayout system of substrates for display. CONSTITUTION:A wafer 1 consisting of an insulating material is first prepd. and plural blocks 3 parted from each other via prescribed separating bands 2 are set. Next, lower layer regions 4 including numerous thin-film transistors are integrated and formed in the respective blocks 3. In succession, the wafer 1 is selectively coated with the flattening films 5 exclusive of the separating bands 2 to fill the ruggedness of the surfaces of the lower layer regions 4 formed in the respective blocks 3. Further, numerous pixel electrodes are integrated and formed in a matrix form on the flat surface of the flattening films 5 within the respective blocks 3, by which upper layer regions 8 are formed. These upper layer regions 8 are electrically connected via the flattening films 5 to the lower layer regions 4. Finally, the wafer 1 is cut along the separating bands 2 and is separated to the individual blocks 3, by which the substrates for display in the form of chips are obtd.</p> |
