发明名称 METHOD AND APPRATUS FOR FORMING A BALL FOR WIRE-BONDING
摘要 <p>In a method and apparatus for making uniform size balls at the end of bonding wires, a constant current circuit is installed between a high voltage power source and a discharge electrode so that a constant high voltage is applied between the bonding wire end and the discharge electrode and a discharge voltage is detected by a discharge voltage detecting circuit so that the thus detected discharge voltage is converted into a time so that a discharge time setting circuit which controls the constant current circuit regulates the discharge time period of the high voltage.</p>
申请公布号 KR960002994(B1) 申请公布日期 1996.03.02
申请号 KR19920006261 申请日期 1992.04.15
申请人 SHINKAWA K.K. 发明人 TERAKADO, YOSHIMITSU;SASAKURA, KAZUMASA
分类号 H01L21/60;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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