| 摘要 |
<p>PURPOSE: To reduce the number of production processes by a method wherein a ceramic base material and a plating solution corrosion resisting inorganic coated layer are formed simultaneously by firing CONSTITUTION: An unfired covered silver wire 2 of long columnar molded material is formed by conducting an extrusion-molding operation in such a manner that a silver fine wire 1 is positioned in the center, a magnetic material slurry 2a, which is formed by kneading Ni-Zn ferrite material and a bonding agent, is intermediately positioned and an inorganic coating slurry 2b, which is formed by kneading insulator material mainly composed of barium titanate and a bonding agent, is positioned outside, and an unfired coated silver wire 2 of long columnar molded body is formed. Then, the silver wire 2 is cut into a chip size, the unfired chip body 3 for ferrite beads obtained by drying is fired, a silver conductive paste film is baked on both ends of the chip body 3, and a fired chip body 8, on which ferrite beads ceramic base material 5, having a silver fine wire 1 and a ferrite layer 4, an inorganic coated layer 6 and a baked conductive film 7 are formed, is formed. Then, the ceramic base material is barrel-plated, and an external electrode 11, on which a Hi plated layer 9 and a solder-plated layer 10 are laminated successively on the baked conductive film 7, is formed.</p> |
