| 摘要 |
<p>PURPOSE: To provide a thin-walled type information storage carrier excellent in durability and a method of manufacturing such a thin-walled type information storage carrier at a low cost. CONSTITUTION: An IC module 1 on which a bare chip 13 is mounted is fixed to substrates 2, 3, and the surface portion of the bare chip is resin-sealed with a rigid protective layer 5 via a flexible protective layer 4. After producing the IC module 1, the lower substrate 2, the upper substrate 3 in which a through hole for resin-sealing is provided, the flexible adhesive sheet 4, and the rigid protective sheet 5, the IC module is set on a predetermined position on the lower substrate. Then, the upper substrate is superposed on the IC module setting face of the lower substrate so as to position the bare chip 13 in the through hole. Thereafter, the adhesive sheet and the protective sheet are housed in the through hole in this order. As a final process, this assembly is heated under pressure to be integrated, thus obtaining a desired information storage carrier.</p> |
