| 摘要 |
<p>PURPOSE: To form side surface electrode layers, which are superior in acid resistance and heat resistance, and to improve the yield of the manufacture of a chip-shaped electronic component by a method wherein a solution obtainable by dispersing silver fine grains or silver and lead fine grains having a specified grain diameter in a solvent is applied to external electrodes and the solution is heat-treated at a specified temperature. CONSTITUTION: Upper surface electrodes 2 and rear electrodes 5 are respectively formed on both surfaces of a 96 alumina substrate 1. An RuO2 resistance layer 4 is formed in such a way as to overlap each one part of the electrodes 2 and an epoxy resin protective layer 6 is provided thereon. The alumina substrate 1 is split into a rectangular form, a solution obtainable by dispersing metal fine grains, which are made by mixing 0.005 to 0.03-μm grain diameter silver fine grains with 0.005 to 0.03-μm grain diameter lead fine grains, in a solvent is applied to the side surfaces of the substrate 1 in such a way as to spread on the upper surface and rear electrode layers 2 and 5 and the solution is heat-treated at 300 deg.C to form side surface electrode layers 3 of a thickness of about 1μm. An Ni-plated layer 7 and a solder-plated layer 8 are formed on the exposed layers 2 and 3 by electrolytic plating. Thereby, the yield of the manufacture of a chip-shaped electronic component is improved and a high- performance square chip resistor can be obtained.</p> |
